Integrated Circuits | High-Speed Energy-Efficient Serial Links

Webinar Abstract

Serial data links are nowadays employed almost everywhere. Within a traditional computer system, we can find a variety of links with various bandwidth requirements such as DDR3 (1.6Gb/s), SATA (3Gb/s), USB (5Gb/s), and PCIe (8Gb/s) links. The industry’s demand for higher quantity and quality of information requires serial links to further support higher bandwidths. The goal of this presentation is to introduce the main principles of serial links, the common architectures employed and the limitations to increasing the data rates.

Speaker’s Bio

Serial data links are nowadays employed almost everywhere. Within a traditional computer system, we can find a variety of links with various bandwidth requirements such as DDR3 (1.6Gb/s), SATA (3Gb/s), USB (5Gb/s), and PCIe (8Gb/s) links. The industry’s demand for higher quantity and quality of information requires serial links to further support higher bandwidths. The goal of this presentation is to introduce the main principles of serial links, the common architectures employed and the limitations to increasing the data rates.

Ahmed Ragab

Ahmed Ragab

Senior Mixed Signal Design Engineer, Nvidia

egyptscholars
[et_bloom_inline optin_id="optin_7"]

More Posts

الدراسة في بلجيكا

يوفر المقال كثير من المعلومات عن بلجيكا ابتداءً من اللغة وتصنيف الجامعات هناك وشروط القبول في المنح الدراسية في الجامعات ونظام الدراسة والرسوم الدراسية والمساعدات المالية ونظام المعيشة من حيث السكن والرعاية الطبية ويتناول المقال أيضاً نظام التعليم ما قبل الجامعي

الدراسة في أستراليا

يحمل المقال تعريفاً باستراليا واستعراضاً لأشهر الجامعات بها و أهم المنح الدراسية في مختلف المجالات مع عرض بعض النصائح لكيفية الاستعداد والتقديم لهذه المنح والقبول بها

Opportunities Newsletter | December 2016 |17|

"Opportunities” is a newsletter about Scholarships, Internships, Fellowships, Academic Positions, Courses and Conferences. Check out our new edition and the different sections below.   Research Assistant (Volunteer) Deadline: January 10 2017 Finesse Graduate...

Opportunities Newsletter | December 2016 |16|

"Opportunities” is a newsletter about Scholarships, Internships, Fellowships, Academic Positions, Courses and Conferences. Check out our new edition and the different sections below.   Scholarships in Japan Deadline: According to the sponsor GDAI - MSc...

Opportunities Newsletter | December 2016 |15|

"Opportunities” is a newsletter about Scholarships, Internships, Fellowships, Academic Positions, Courses and Conferences. Check out our new edition and the different sections below.   Bond University Scholarships Deadline: March 31 2017 The University of Tokyo...

Pin It on Pinterest

Share This